IPC A 600 Training 2025
February 10-13 & February 12-14, 2025Who is this course for?
This course is designed for individuals responsible for ensuring the quality and reliability of electronic assemblies. It is particularly relevant for trainers and quality supervisors well-versed in electronic assembly, as well as engineering and manufacturing supervisors with assembly responsibilities.
Detail
Topics covered
Printed Board Product Classifications and Acceptance Criteria
Base Material Surface and Subsurface Conditions, Including Measling/Crazing
Solder Resist Coverage Over Conductors and Registration to Lands
Conductor Width and Spacing, Including Annular Ring Requirements
Dielectric Material Criteria, Covering Etchback, Voids, and Resin Recession
Plated-Through Hole Requirements, Addressing Copper Plating Thickness, Voids, Nodules, and Cracks
Acceptance Criteria for Flexible, Rigid-Flex, and Metal Core Printed Boards
Effective Teaching Skills for the Lesson Plan
What’s included
Downloadable student files from IPC (CIT only)
IPC Certificate upon successful completion of class and test
Snacks, refreshments, and lunch daily
Agenda
Day 1: Introduction & Fundamentals
8:30 AM - 9:00 AM – Registration & Welcome
Introduction to IPC-A-600
Training objectives and expectations
9:00 AM - 10:30 AM – Overview of IPC Standards
Relationship between IPC-A-600, IPC-6012, and other standards
Importance of PCB quality and reliability
10:30 AM - 10:45 AM – Break
10:45 AM - 12:00 PM – PCB Manufacturing Processes
PCB construction & materials
Layer stack-up, vias, and surface finishes
12:00 PM - 1:00 PM – Lunch
1:00 PM - 2:30 PM – Acceptance Criteria Overview (Part 1)
External & internal observable conditions
Bow, twist, and dimensional tolerances
2:30 PM - 2:45 PM – Break
2:45 PM - 4:30 PM – Visual Inspection & Defects (Part 1)
Conductive pattern anomalies
Laminate defects, plating issues
4:30 PM - 5:00 PM – Q&A and Recap
Day 2: Advanced Inspection & Certification
8:30 AM - 9:00 AM – Review of Day 1 & Key Takeaways
9:00 AM - 10:30 AM – Acceptance Criteria Overview (Part 2)
Solder mask defects, cleanliness, and marking requirements
Hole size, plating thickness, and via issues
10:30 AM - 10:45 AM – Break
10:45 AM - 12:00 PM – Visual Inspection & Defects (Part 2)
Hands-on defect analysis with real samples/images
Discussion on defect causes and prevention
12:00 PM - 1:00 PM – Lunch
1:00 PM - 2:30 PM – Final Review & Exam Preparation
Common failure modes in PCBs
Review of key concepts and sample questions
2:30 PM - 2:45 PM – Break
2:45 PM - 4:00 PM – Certification Exam (if applicable)
Open-book or closed-book based on IPC requirements
4:00 PM - 4:30 PM – Wrap-up & Certificate Distribution